HI1-303/883
vs
DG301BK
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MAXIM INTEGRATED PRODUCTS INC
Package Description
CERAMIC, DIP-14
DIP, DIP14,.3
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
1
Number of Functions
2
1
Number of Terminals
14
14
Off-state Isolation-Nom
40 dB
62 dB
On-state Resistance-Max (Ron)
50 Ω
50 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-25 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
250 ns
250 ns
Switch-on Time-Max
300 ns
300 ns
Technology
CMOS
CMOS
Temperature Grade
MILITARY
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
3
1
Pbfree Code
Part Package Code
DIP
Pin Count
14
Length
19.43 mm
Neg Supply Voltage-Max (Vsup)
-18 V
Neg Supply Voltage-Min (Vsup)
-5 V
Package Equivalence Code
DIP14,.3
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
5 V
Switching
BREAK-BEFORE-MAKE
Compare HI1-303/883 with alternatives
Compare DG301BK with alternatives