HI1-201/883
vs
7705302EA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
HARRIS SEMICONDUCTOR
RENESAS ELECTRONICS CORP
Package Description
,
CERAMIC, DIP-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
1
Number of Functions
4
4
Number of Terminals
16
16
Off-state Isolation-Nom
55 dB
On-state Resistance-Max (Ron)
70 Ω
70 Ω
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max (Isup)
2 mA
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
500 ns
650 ns
Switch-on Time-Max
600 ns
800 ns
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Part Package Code
CERDIP
Pin Count
16
Manufacturer Package Code
F16.3
ECCN Code
EAR99
Factory Lead Time
26 Weeks, 1 Day
Samacsys Manufacturer
Renesas Electronics
Screening Level
MIL-STD-883
Compare HI1-201/883 with alternatives
Compare 7705302EA with alternatives