HI1-0507/883
vs
DG407DN
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-GDIP-T28
|
S-PQCC-J28
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Off-state Isolation-Nom |
68 dB
|
69 dB
|
| On-state Resistance Match-Nom |
9 Ω
|
5 Ω
|
| On-state Resistance-Max (Ron) |
300 Ω
|
100 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Switch-off Time-Max |
500 ns
|
300 ns
|
| Switch-on Time-Max |
500 ns
|
300 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
4
|
7
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
LDCC(UNSPEC)
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare HI1-0507/883 with alternatives