HHS60ZEN8
vs
EXB250-48S3V3-RJ
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Not Recommended
|
Transferred
|
| Ihs Manufacturer |
POWER-ONE INC
|
ARTESYN TECHNOLOGIES INC
|
| Part Package Code |
MODULE
|
MODULE
|
| Package Description |
HALF BRICK PACKAGE-9
|
,
|
| Pin Count |
9
|
9
|
| Reach Compliance Code |
compliant
|
unknown
|
| Analog IC - Other Type |
DC-DC REGULATED POWER SUPPLY MODULE
|
DC-DC REGULATED POWER SUPPLY MODULE
|
| Input Voltage-Max |
75 V
|
75 V
|
| Input Voltage-Min |
36 V
|
33 V
|
| Input Voltage-Nom |
48 V
|
48 V
|
| JESD-30 Code |
R-XDMA-P9
|
R-XDMA-P9
|
| JESD-609 Code |
e0
|
|
| Length |
61 mm
|
|
| Load Regulation-Max |
0.2%
|
0.2%
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
110 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
3.63 V
|
3.63 V
|
| Output Voltage-Min |
2.97 V
|
2.97 V
|
| Output Voltage-Nom |
3.3 V
|
3.3 V
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Total Power Output-Max |
198 W
|
165 W
|
| Trim/Adjustable Output |
YES
|
YES
|
| Width |
57.9 mm
|
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
|
|
|
Compare HHS60ZEN8 with alternatives
Compare EXB250-48S3V3-RJ with alternatives