HGT1S12N60A4DS
vs
HGTG20N60B3
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
D2PAK
|
TO-247
|
| Pin Count |
2
|
3
|
| Manufacturer Package Code |
2LD,TO263, SURFACE MOUNT
|
TO-247,MOLDED,3 LEAD,JEDEC VARIATION AB
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.95
|
8541.29.00.95
|
| Additional Feature |
LOW CONDUCTION LOSS
|
LOW CONDUCTION LOSS
|
| Case Connection |
COLLECTOR
|
COLLECTOR
|
| Collector Current-Max (IC) |
54 A
|
40 A
|
| Collector-Emitter Voltage-Max |
600 V
|
600 V
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
| Fall Time-Max (tf) |
95 ns
|
175 ns
|
| Gate-Emitter Voltage-Max |
20 V
|
|
| JEDEC-95 Code |
TO-263AB
|
TO-247
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSFM-T3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
167 W
|
165 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
POWER CONTROL
|
POWER CONTROL
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Nom (toff) |
180 ns
|
360 ns
|
| Turn-on Time-Nom (ton) |
33 ns
|
45 ns
|
| Base Number Matches |
4
|
4
|
| Package Description |
|
TO-247. 3 PIN
|
| Gate-Emitter Thr Voltage-Max |
|
6 V
|
|
|
|
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