HGCB2010DBD178M
vs
SM2010K1786DSBU
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
STACKPOLE ELECTRONICS INC
|
OHMCRAFT
|
| Package Description |
SMT, 2010
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00.30
|
|
| Additional Feature |
PRECISION
|
|
| Construction |
Rectangular
|
Chip
|
| JESD-609 Code |
e3
|
e0
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.76 mm
|
0.76 mm
|
| Package Length |
5.08 mm
|
5.08 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.54 mm
|
2.54 mm
|
| Packing Method |
BULK
|
Bulk
|
| Rated Power Dissipation (P) |
1 W
|
1 W
|
| Rated Temperature |
75 °C
|
|
| Resistance |
178000000 Ω
|
178000000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2010
|
2010
|
| Surface Mount |
YES
|
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Tin/Lead (Sn63Pb37)
|
| Terminal Shape |
WRAPAROUND
|
|
| Tolerance |
0.5%
|
0.5%
|
| Working Voltage |
300 V
|
300 V
|
| Base Number Matches |
1
|
1
|
| Series |
|
SM
|
|
|
|
Compare HGCB2010DBD178M with alternatives
Compare SM2010K1786DSBU with alternatives