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HGCB2010DBC13M8 vs SM2010H1385DSTR feature comparison

HGCB2010DBC13M8 SEI Stackpole Electronics Inc

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SM2010H1385DSTR Ohmcraft

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Rohs Code Yes No
Part Life Cycle Code Active Contact Manufacturer
Ihs Manufacturer STACKPOLE ELECTRONICS INC OHMCRAFT
Package Description SMT, 2010
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Additional Feature PRECISION
Construction Rectangular Chip
JESD-609 Code e3 e0
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.76 mm 0.76 mm
Package Length 5.08 mm 5.08 mm
Package Style SMT SMT
Package Width 2.54 mm 2.54 mm
Packing Method BULK TR
Rated Power Dissipation (P) 1 W 1 W
Rated Temperature 75 °C
Resistance 13800000 Ω 13800000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 50 ppm/°C 50 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier Tin/Lead (Sn63Pb37)
Terminal Shape WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 300 V 300 V
Base Number Matches 1 1
Series SM
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare HGCB2010DBC13M8 with alternatives

Compare SM2010H1385DSTR with alternatives