HFA1405IA96
vs
LMH6722QSD
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTERSIL CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
|
Package Description |
SSOP,
|
VSSOP,
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G14
|
Length |
4.89 mm
|
4 mm
|
Number of Functions |
1
|
4
|
Number of Terminals |
16
|
14
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
VSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.73 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare HFA1405IA96 with alternatives
Compare LMH6722QSD with alternatives