HFA1105IBZ
vs
LT1223CN8
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
LINEAR TECHNOLOGY CORP
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
ROHS COMPLIANT, PLASTIC, MS-012AA, SOIC-8
|
DIP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
4.9 mm
|
10.16 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
3.937 mm
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
N
|
| Average Bias Current-Max (IIB) |
|
3 µA
|
| Common-mode Reject Ratio-Nom |
|
63 dB
|
| Input Offset Voltage-Max |
|
3000 µV
|
| Neg Supply Voltage Limit-Max |
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Slew Rate-Nom |
|
1300 V/us
|
| Supply Voltage Limit-Max |
|
18 V
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Unity Gain BW-Nom |
|
100000
|
|
|
|
Compare HFA1105IBZ with alternatives
Compare LT1223CN8 with alternatives