HEF4539BP
vs
HCF40257BC1
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
STMICROELECTRONICS
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP, DIP16,.3
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
20
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDIP-T16
|
S-PQCC-J20
|
| Length |
21.6 mm
|
8.965 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.00035999999999999997 A
|
|
| Number of Functions |
2
|
4
|
| Number of Inputs |
4
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP16,.3
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Prop. Delay@Nom-Sup |
245 ns
|
300 ns
|
| Propagation Delay (tpd) |
240 ns
|
380 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.7 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
8.965 mm
|
| Base Number Matches |
3
|
1
|
| JESD-609 Code |
|
e3
|
| Output Characteristics |
|
3-STATE
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare HEF4539BP with alternatives
Compare HCF40257BC1 with alternatives