HEF4539BDB
vs
CD40257BPWRE4
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Package Description |
DIP,
|
TSSOP, TSSOP16,.25
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
2
|
4
|
| Number of Inputs |
4
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
330 ns
|
300 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
16
|
| Length |
|
5 mm
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Prop. Delay@Nom-Sup |
|
300 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HEF4539BDB with alternatives
Compare CD40257BPWRE4 with alternatives