HEF4515BT-T
vs
HD74ACT138T
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP,
|
TSSOP,
|
| Pin Count |
24
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ADDRESS LATCHES
|
|
| Family |
4000/14000/40000
|
ACT
|
| Input Conditioning |
LATCHED
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
|
| Length |
15.4 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
4-LINE TO 16-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
550 ns
|
11.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.5 mm
|
4.4 mm
|
| Base Number Matches |
1
|
6
|
| Pbfree Code |
|
No
|
|
|
|
Compare HEF4515BT-T with alternatives
Compare HD74ACT138T with alternatives