HEF4515BP,652 vs HCC4515BF feature comparison

HEF4515BP,652 NXP Semiconductors

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HCC4515BF STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description PLASTIC, SOT-101-1, DIP-24 DIP, DIP24,.6
Pin Count 24 24
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Family 4000/14000/40000 4000/14000/40000
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e3 e0
Length 31.7 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 4-LINE TO 16-LINE DECODER
Max I(ol) 0.00035999999999999997 A
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 550 ns 970 ns
Propagation Delay (tpd) 550 ns 970 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.71 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Additional Feature ADDRESS LATCHES

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