HEF4514BPN vs MC74LCX139MEL feature comparison

HEF4514BPN NXP Semiconductors

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MC74LCX139MEL onsemi

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ON SEMICONDUCTOR
Part Package Code DIP SOIC
Package Description DIP, DIP24,.6 SOP, SOP16,.3
Pin Count 24 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Family 4000/14000/40000 LVC/LCX/Z
Input Conditioning LATCHED STANDARD
JESD-30 Code R-PDIP-T24 R-PDSO-G16
JESD-609 Code e2 e4
Length 31.7 mm 10.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.00035999999999999997 A 0.024 A
Number of Functions 1 2
Number of Terminals 24 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP24,.6 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 550 ns 6.2 ns
Propagation Delay (tpd) 520 ns 9.3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 2.05 mm
Supply Voltage-Max (Vsup) 18 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 5 V 2.7 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 5.275 mm
Base Number Matches 1 2
Moisture Sensitivity Level 3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA

Compare HEF4514BPN with alternatives

Compare MC74LCX139MEL with alternatives