HEF4514BPN
vs
CD4514BCWMX
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP24,.6
|
SOP, SOP24,.4
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| Input Conditioning |
LATCHED
|
LATCHED
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDSO-G24
|
| JESD-609 Code |
e2
|
e0
|
| Length |
31.7 mm
|
15.4 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
4-LINE TO 16-LINE DECODER
|
4-LINE TO 16-LINE DECODER
|
| Max I(ol) |
0.00035999999999999997 A
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP24,.6
|
SOP24,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Prop. Delay@Nom-Sup |
550 ns
|
1100 ns
|
| Propagation Delay (tpd) |
520 ns
|
1100 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.1 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN SILVER
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
ADDRESS LATCHES
|
| Packing Method |
|
TR
|
|
|
|
Compare HEF4514BPN with alternatives
Compare CD4514BCWMX with alternatives