HEF4514BPN vs CD4028BM feature comparison

HEF4514BPN NXP Semiconductors

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CD4028BM Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, DIP24,.6 SOIC-16
Pin Count 24 16
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP Texas Instruments
Family 4000/14000/40000 4000/14000/40000
Input Conditioning LATCHED STANDARD
JESD-30 Code R-PDIP-T24 R-PDSO-G16
JESD-609 Code e2 e4
Length 31.7 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER DECIMAL DECODER/DRIVER
Max I(ol) 0.00035999999999999997 A 0.0015 A
Number of Functions 1 1
Number of Terminals 24 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP24,.6 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 550 ns 160 ns
Propagation Delay (tpd) 520 ns 350 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN SILVER NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 3.9 mm
Base Number Matches 1 24
Pbfree Code Yes
Moisture Sensitivity Level 1
Number of Bits 10
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 3 mA
Time@Peak Reflow Temperature-Max (s) 30

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