HEF4514BP,652
vs
MC14514BCL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP24,.6
DIP,
Pin Count
24
24
Manufacturer Package Code
SOT101-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Family
4000/14000/40000
4000/14000/40000
Input Conditioning
LATCHED
LATCHED
JESD-30 Code
R-PDIP-T24
R-CDIP-T24
JESD-609 Code
e2
e0
Length
31.7 mm
32.005 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
4-LINE TO 16-LINE DECODER
4-LINE TO 16-LINE DECODER
Max I(ol)
0.00035999999999999997 A
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
550 ns
Propagation Delay (tpd)
550 ns
1100 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
5.59 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN SILVER
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
4
ECCN Code
EAR99
Additional Feature
ADDRESS LATCHES
Compare HEF4514BP,652 with alternatives
Compare MC14514BCL with alternatives