HEF4514BP,652
vs
CD4514BEX
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
HARRIS SEMICONDUCTOR
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP24,.6
|
DIP, DIP24,.6
|
Pin Count |
24
|
|
Manufacturer Package Code |
SOT101-1
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
|
Family |
4000/14000/40000
|
4000/14000/40000
|
Input Conditioning |
LATCHED
|
LATCHED
|
JESD-30 Code |
R-PDIP-T24
|
R-PDIP-T24
|
JESD-609 Code |
e2
|
e0
|
Length |
31.7 mm
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
4-LINE TO 16-LINE DECODER
|
4-LINE TO 16-LINE DECODER
|
Max I(ol) |
0.00035999999999999997 A
|
0.00041999999999999996 A
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.6
|
DIP24,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Prop. Delay@Nom-Sup |
550 ns
|
970 ns
|
Propagation Delay (tpd) |
550 ns
|
970 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.1 mm
|
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
TIN SILVER
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
EAR99
|
Additional Feature |
|
ADDRESS LATCHES
|
|
|
|
Compare HEF4514BP,652 with alternatives
Compare CD4514BEX with alternatives