HEF4512BPN
vs
5962-01-324-1859
feature comparison
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
,
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
|
JESD-30 Code |
R-PDIP-T16
|
|
Length |
21.6 mm
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
MULTIPLEXER
|
|
Number of Functions |
1
|
|
Number of Inputs |
8
|
|
Number of Outputs |
1
|
|
Number of Terminals |
16
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
DIP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Propagation Delay (tpd) |
200 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.7 mm
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Width |
7.62 mm
|
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
|
|
|
Compare HEF4512BPN with alternatives
Compare 5962-01-324-1859 with alternatives