HEF4511BP
vs
74F139SJ
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
5.30 MM, EIAJ TYPE2, SOP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
BLANKING INPUT; LAMP TEST INPUT; LED DISPLAY DRIVER; IOH = 20MA @ VOH = 2.5V
|
|
| Family |
4000/14000/40000
|
F/FAST
|
| Input Conditioning |
LATCHED
|
STANDARD
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e3
|
| Length |
21.6 mm
|
10.2 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
SEVEN SEGMENT DECODER/DRIVER
|
2-LINE TO 4-LINE DECODER
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
310 ns
|
9 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.7 mm
|
2.1 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
5.3 mm
|
| Base Number Matches |
4
|
2
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare HEF4511BP with alternatives
Compare 74F139SJ with alternatives