HEF4502BPB vs M38510/17403BEX feature comparison

HEF4502BPB NXP Semiconductors

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M38510/17403BEX SRI International Sarnoff

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS SRI INTERNATIONAL
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH COMMON INHIBIT FOR ALL BITS
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Length 21.6 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 6 6
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 170 ns 535 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm
Supply Voltage-Max (Vsup) 15 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2
Part Package Code DIP
Pin Count 16
Screening Level MIL-PRF-38535 Class B

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Compare M38510/17403BEX with alternatives