HEF4502BDB
vs
5962R9661602VEC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTERSIL CORP
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH COMMON INHIBIT FOR ALL BITS
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-CDIP-T16
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
6
6
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
170 ns
513 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
2
Part Package Code
DIP
Pin Count
16
Control Type
ENABLE LOW
JESD-609 Code
e4
Max I(ol)
0.0038399999999999997 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
513 ns
Screening Level
MIL-PRF-38535 Class V
Terminal Finish
GOLD
Total Dose
100k Rad(Si) V
Compare HEF4502BDB with alternatives
Compare 5962R9661602VEC with alternatives