HEF4085BPN vs M38510H17201SCX feature comparison

HEF4085BPN Philips Semiconductors

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M38510H17201SCX Cobham Semiconductor Solutions

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS AEROFLEX COLORADO SPRINGS
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type AND-OR-INVERT GATE AND-OR-INVERT GATE
Max I(ol) 0.00035999999999999997 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 155 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 3
Family 4000/14000/40000
Number of Functions 2
Number of Inputs 4
Propagation Delay (tpd) 870 ns
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Total Dose 1M Rad(Si) V

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