HEF4085BP vs CD4085BF feature comparison

HEF4085BP NXP Semiconductors

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CD4085BF Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description PLASTIC, DIP-14 PACKAGE-14
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Additional Feature EXPANDABLE EXPANDABLE
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Length 19.025 mm
Load Capacitance (CL) 50 pF
Logic IC Type AND-OR-INVERT GATE AND-OR-INVERT GATE
Max I(ol) 0.00035999999999999997 A
Number of Functions 2 2
Number of Inputs 4 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 155 ns
Propagation Delay (tpd) 155 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.2 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 7
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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