HEF4076BTD vs 933373060653 feature comparison

HEF4076BTD Philips Semiconductors

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933373060653 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SOP, SOP16,.25 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Category CO2 Kg 12 12
Compliance Temperature Grade Industrial: -40C to +85C
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 4000000 Hz
Max I(ol) 0.00035999999999999997 A
Number of Functions 4 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 2 1
Part Package Code SOIC
Pin Count 16
Family 4000/14000/40000
Length 9.9 mm
Number of Bits 4
Output Polarity TRUE
Propagation Delay (tpd) 320 ns
Seated Height-Max 1.75 mm
Supply Voltage-Nom (Vsup) 5 V
Width 3.9 mm
fmax-Min 16 MHz

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