HEF4076BPN vs CD4076BE feature comparison

HEF4076BPN Philips Semiconductors

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CD4076BE Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 4000000 Hz
Max I(ol) 0.00035999999999999997 A
Number of Functions 4 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified COMMERCIAL
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 2 7
Part Package Code DIP
Pin Count 16
Additional Feature WITH HOLD MODE; WITH DUAL OUTPUT ENABLE
Family 4000/14000/40000
Length 19.17 mm
Number of Bits 4
Output Polarity TRUE
Seated Height-Max 5.33 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm