HEF4076BD
vs
5962R9665601VEX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH HOLD MODE; WITH DUAL OUTPUT ENABLE
HOLD MODE; DUAL OUTPUT ENABLE; RADIATION HARDENED
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-CDIP-T16
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
4000000 Hz
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
305 ns
810 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
4 MHz
2.22 MHz
Base Number Matches
2
3
Total Dose
100k Rad(Si) V
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