HEF4073BT-T
vs
MC14073BD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
MOTOROLA INC
Package Description
SOP,
SOP, SOP14,.25
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2017-02-01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e0
Logic IC Type
AND GATE
AND GATE
Moisture Sensitivity Level
1
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
110 ns
300 ns
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
2
5
Part Package Code
SOIC
Pin Count
14
Length
8.65 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.004200000000000001 A
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Equivalence Code
SOP14,.25
Prop. Delay@Nom-Sup
300 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.75 mm
Temperature Grade
MILITARY
Terminal Pitch
1.27 mm
Width
3.9 mm
Compare HEF4073BT-T with alternatives
Compare MC14073BD with alternatives