HEF4067BT,653 vs MC14067BDW feature comparison

HEF4067BT,653 NXP Semiconductors

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MC14067BDW Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOP
Package Description SOT-137, PLASTIC, SO-24 PLASTIC, SOIC-24
Pin Count 24
Manufacturer Package Code SOT137-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Analog IC - Other Type SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e4 e0
Length 15.4 mm 15.395 mm
Moisture Sensitivity Level 1
Neg Supply Voltage-Nom (Vsup)
Number of Channels 16 16
Number of Functions 1 1
Number of Terminals 24 24
Off-state Isolation-Nom 50 dB 40 dB
On-state Resistance Match-Nom 5 Ω 10 Ω
On-state Resistance-Max (Ron) 175 Ω 280 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP24,.4 SOP24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Current-Max (Isup) 0.6 mA 0.6 mA
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount YES YES
Switch-off Time-Max 340 ns 190 ns
Switch-on Time-Max 100 ns 190 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 7.5 mm
Base Number Matches 2 4
Signal Current-Max 0.025 A

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