HEF4067BDF
vs
MC14067BCL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP,
DIP, DIP24,.6
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Analog IC - Other Type
SINGLE-ENDED MULTIPLEXER
SINGLE-ENDED MULTIPLEXER
JESD-30 Code
R-GDIP-T24
R-XDIP-T24
Neg Supply Voltage-Nom (Vsup)
Number of Channels
16
16
Number of Functions
1
1
Number of Terminals
24
24
Off-state Isolation-Nom
50 dB
On-state Resistance Match-Nom
5 Ω
On-state Resistance-Max (Ron)
175 Ω
1300 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.84 mm
Supply Voltage-Nom (Vsup)
15 V
Surface Mount
NO
NO
Switch-off Time-Max
340 ns
Switch-on Time-Max
100 ns
600 ns
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Power Supplies
5/15 V
Signal Current-Max
0.025 A
Supply Current-Max (Isup)
0.6 mA
Terminal Finish
Tin/Lead (Sn/Pb)
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