HEF4060BDF vs CD4060AD3 feature comparison

HEF4060BDF NXP Semiconductors

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CD4060AD3 Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature OUTPUTS FROM 10 STAGES AVAILABLE; BUILT-IN OSCILLATOR; OSCILLATOR DISABLED BY CLEAR INPUT
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-XDIP-T16
Load/Preset Input YES NO
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 14 14
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 420 ns 740 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 7.62 mm
fmax-Min 30 MHz
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP16,.3
Screening Level 38535Q/M;38534H;883B
Terminal Finish Tin/Lead (Sn/Pb)

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