HEF4059BPN
vs
CD4059AF3
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
HARRIS SEMICONDUCTOR
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDIP-T24
|
R-XDIP-T24
|
Logic IC Type |
PRESCALER
|
PRESCALER
|
Max Frequency@Nom-Sup |
3500000 Hz
|
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.6
|
DIP24,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Package Description |
|
DIP-24
|
JESD-609 Code |
|
e0
|
Power Supply Current-Max (ICC) |
|
50 mA
|
Screening Level |
|
38535Q/M;38534H;883B
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|