HEF4052BT
vs
CD4052BCM
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
ROCHESTER ELECTRONICS INC
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
e3
|
Number of Channels |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
On-state Resistance-Max (Ron) |
2500 Ω
|
1050 Ω
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Signal Current-Max |
0.01 A
|
|
Supply Current-Max (Isup) |
0.6 mA
|
|
Surface Mount |
YES
|
YES
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
4
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Package Description |
|
SOP,
|
Pin Count |
|
16
|
Length |
|
9.9 mm
|
Moisture Sensitivity Level |
|
1
|
Neg Supply Voltage-Max (Vsup) |
|
|
Neg Supply Voltage-Min (Vsup) |
|
|
Neg Supply Voltage-Nom (Vsup) |
|
|
On-state Resistance Match-Nom |
|
10 Ω
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
|
15 V
|
Supply Voltage-Min (Vsup) |
|
5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Switch-off Time-Max |
|
420 ns
|
Switch-on Time-Max |
|
1200 ns
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
3.9 mm
|
|
|
|
Compare CD4052BCM with alternatives