HEF4052BP,652
vs
CD4052BMJ/883
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
PLASTIC, DIP-16
DIP, DIP16,.3
Pin Count
16
Manufacturer Package Code
SOT38-4
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Analog IC - Other Type
DIFFERENTIAL MULTIPLEXER
DIFFERENTIAL MULTIPLEXER
JESD-30 Code
R-PDIP-T16
R-XDIP-T16
JESD-609 Code
e4
e0
Length
21.6 mm
Neg Supply Voltage-Nom (Vsup)
Number of Channels
4
4
Number of Functions
1
1
Number of Terminals
16
16
Off-state Isolation-Nom
50 dB
On-state Resistance Match-Nom
5 Ω
On-state Resistance-Max (Ron)
175 Ω
3500 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.7 mm
Supply Current-Max (Isup)
0.6 mA
0.6 mA
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
15 V
Surface Mount
NO
NO
Switch-off Time-Max
180 ns
Switch-on Time-Max
85 ns
1200 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
3
Screening Level
38535Q/M;38534H;883B
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