HEF4050BT,653 vs CD4050BF feature comparison

HEF4050BT,653 NXP Semiconductors

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CD4050BF Rochester Electronics LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SOP DIP
Package Description PLASTIC, SO-16
Pin Count 16 16
Manufacturer Package Code SOT109-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CMOS-TTL LEVEL TRANSLATOR
Family 4000/14000/40000
JESD-30 Code R-PDSO-G16
JESD-609 Code e4
Length 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1
Number of Functions 6
Number of Inputs 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 110 ns
Propagation Delay (tpd) 70 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm
Base Number Matches 2 7
Pbfree Code No

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