Findchips: Compare HEF4050BT,652 vs 933372930652

HEF4050BT,652 vs 933372930652 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NEXPERIA
Part Package Code	SOP
Package Description	PLASTIC, SO-16	SOP,
Pin Count	16
Manufacturer Package Code	SOT109-1
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Additional Feature	CMOS-TTL LEVEL TRANSLATOR
Family	4000/14000/40000	4000/14000/40000
JESD-30 Code	R-PDSO-G16	R-PDSO-G16
JESD-609 Code	e4	e4
Length	9.9 mm	9.9 mm
Load Capacitance (CL)	50 pF
Logic IC Type	BUFFER	BUFFER
Moisture Sensitivity Level	1	1
Number of Functions	6	6
Number of Inputs	1	1
Number of Terminals	16	16
Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Equivalence Code	SOP16,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Packing Method	BULK
Peak Reflow Temperature (Cel)	260	260
Prop. Delay@Nom-Sup	110 ns
Propagation Delay (tpd)	70 ns	110 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1.75 mm	1.75 mm
Supply Voltage-Max (Vsup)	15 V	15 V
Supply Voltage-Min (Vsup)	3 V	3 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	3.9 mm	3.9 mm
Base Number Matches	2	2
	Logic » Gates	Logic » Gates