HEF4050BDF vs JM38510/05553BEA feature comparison

HEF4050BDF NXP Semiconductors

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JM38510/05553BEA Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CMOS-TTL LEVEL TRANSLATOR
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 70 ns 120 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 10 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code No
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
JESD-609 Code e0
Length 19.05 mm
Max I(ol) 0.018 A
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.6 mA
Screening Level MIL-M-38510 Class B
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HEF4050BDF with alternatives

Compare JM38510/05553BEA with alternatives