HEF4047BN
vs
CD4047BEX
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTERSIL CORP
|
Package Description |
DIP,
|
DIP, DIP14,.3
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
|
JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
Length |
19.025 mm
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
MONOSTABLE MULTIVIBRATOR
|
MONOSTABLE MULTIVIBRATOR
|
Number of Data/Clock Inputs |
2
|
|
Number of Functions |
1
|
|
Number of Terminals |
14
|
14
|
Output Polarity |
COMPLEMENTARY
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Propagation Delay (tpd) |
320 ns
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
4.2 mm
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
DIP14,.3
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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