HEF4046BP,652
vs
CD74HC4046APWR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
TSSOP
|
| Package Description |
DIP, DIP16,.3
|
TSSOP-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT38-4
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
Texas Instruments
|
| Analog IC - Other Type |
PHASE LOCKED LOOP
|
PHASE LOCKED LOOP
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
21.6 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP16,.3
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.7 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max (Isup) |
|
0.16 mA
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HEF4046BP,652 with alternatives
Compare CD74HC4046APWR with alternatives