HEF4044BT
vs
CD4044BFX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP16,.25
DIP,
Pin Count
16
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
JESD-609 Code
e4
e0
Length
9.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
R-S LATCH
R-S LATCH
Moisture Sensitivity Level
1
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
BULK
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
185 ns
Propagation Delay (tpd)
185 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
LOW LEVEL
LOW LEVEL
Width
3.9 mm
7.62 mm
Base Number Matches
6
1
Compare HEF4044BT with alternatives
Compare CD4044BFX with alternatives