HEF4043BP vs MC14043BAL feature comparison

HEF4043BP NXP Semiconductors

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MC14043BAL Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, SOT38-4, DIP-16 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e4 e0
Length 19.025 mm 19.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type R-S LATCH R-S LATCH
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method BULK
Prop. Delay@Nom-Sup 180 ns
Propagation Delay (tpd) 180 ns 350 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 4.19 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL HIGH LEVEL
Width 7.62 mm 7.62 mm
Base Number Matches 4 3

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