HEF40373BDB vs HEF40373BD feature comparison

HEF40373BDB NXP Semiconductors

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HEF40373BD NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, SOT-152, CERDIP-20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IOH = 9.3MA @ VOH = 3.6V IOH = 9.3MA @ VOH = 3.6V
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T20 R-GDIP-T20
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 300 ns 300 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 3
Rohs Code No
Part Package Code DIP
Pin Count 20
Max I(ol) 0.00175 A
Moisture Sensitivity Level 1
Package Equivalence Code DIP20,.3
Power Supply Current-Max (ICC) 100 mA
Prop. Delay@Nom-Sup 300 ns

Compare HEF40373BDB with alternatives

Compare HEF40373BD with alternatives