HEF4029BTD
vs
CD4029BFMSR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTERSIL CORP
Part Package Code
SOIC
DIP
Package Description
SOP,
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
BINARY/BCD COUNT OPTION; TCO OUTPUT; COUNT ENABLE INPUT
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
Length
9.9 mm
9.585 mm
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
290 ns
675 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.33 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
7.62 mm
fmax-Min
15 MHz
1.48 MHz
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.00035999999999999997 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
675 ns
Screening Level
MIL-PRF-38535 Class V
Terminal Finish
TIN LEAD
Total Dose
100k Rad(Si) V
Compare HEF4029BTD with alternatives
Compare CD4029BFMSR with alternatives