HEF4024BP
vs
MC14024BAL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
0.300 INCH, PLASTIC, SOT-27-1, DIP-14
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Count Direction
UP
UP
Family
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-XDIP-T14
JESD-609 Code
e4
e0
Length
19.025 mm
Load Capacitance (CL)
50 pF
Load/Preset Input
NO
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Max Frequency@Nom-Sup
5000000 Hz
Max I(ol)
0.00035999999999999997 A
Mode of Operation
ASYNCHRONOUS
ASYNCHRONOUS
Number of Bits
7
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
210 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
Width
7.62 mm
fmax-Min
18 MHz
Base Number Matches
2
3
Power Supplies
5/15 V
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