HEF4024BDB vs MC14024BCPG feature comparison

HEF4024BDB NXP Semiconductors

Buy Now Datasheet

MC14024BCPG onsemi

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Package Description DIP, ROHS COMPLIANT, PLASTIC, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Load/Preset Input YES NO
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 7 7
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 200 ns 2000 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.69 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 5 MHz 4 MHz
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
Samacsys Manufacturer onsemi
JESD-609 Code e3
Length 18.86 mm
Max Frequency@Nom-Sup 1000000 Hz
Package Equivalence Code DIP14,.3
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

Compare HEF4024BDB with alternatives

Compare MC14024BCPG with alternatives