HEF40193BDB vs 5962R9660802VEX feature comparison

HEF40193BDB NXP Semiconductors

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5962R9660802VEX Renesas Electronics Corporation

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Package Description DIP, DIP,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TCO UP AND TCO DOWN OUTPUTS; SEPARATE UP/DOWN CLOCK TCO UP AND TCO DOWN OUTPUTS; SEPARATE UP/DOWN CLOCK
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-CDIP-T16
Load Capacitance (CL) 50 pF
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 425 ns 675 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 2.5 MHz 1.48 MHz
Base Number Matches 1 1
Length 19.05 mm

Compare HEF40193BDB with alternatives

Compare 5962R9660802VEX with alternatives