HEF40175BT,653
vs
CD40175BKMSH
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Part Package Code
SOP
Package Description
PLASTIC, SO-16
DFP, FL16,.3
Pin Count
16
Manufacturer Package Code
SOT109-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-CDFP-F16
JESD-609 Code
e4
e0
Length
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
5000000 Hz
2000000 Hz
Moisture Sensitivity Level
1
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DFP
Package Equivalence Code
SOP16,.25
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
FLATPACK
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
160 ns
540 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
fmax-Min
5 MHz
1.48 MHz
Base Number Matches
1
1
Additional Feature
RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT
Max I(ol)
0.00035999999999999997 A
Prop. Delay@Nom-Sup
675 ns
Screening Level
38535V;38534K;883S
Total Dose
1M Rad(Si) V
Compare HEF40175BT,653 with alternatives
Compare CD40175BKMSH with alternatives