HEF40174BT
vs
CD40174BCMX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP16,.25
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e0
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
5000000 Hz
2000000 Hz
Max I(ol)
0.00035999999999999997 A
Moisture Sensitivity Level
1
Number of Bits
6
6
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
155 ns
300 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
3.9 mm
fmax-Min
20 MHz
6 MHz
Base Number Matches
2
1
Packing Method
TR
Compare HEF40174BT with alternatives
Compare CD40174BCMX with alternatives