HEF40174BP
vs
CD40174BE98
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
HARRIS SEMICONDUCTOR
|
Package Description |
,
|
DIP, DIP16,.3
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Base Number Matches |
4
|
3
|
Rohs Code |
|
No
|
JESD-30 Code |
|
R-PDIP-T16
|
JESD-609 Code |
|
e0
|
Load Capacitance (CL) |
|
50 pF
|
Max Frequency@Nom-Sup |
|
3500000 Hz
|
Max I(ol) |
|
0.00041999999999999996 A
|
Number of Functions |
|
6
|
Number of Terminals |
|
16
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP16,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Packing Method |
|
TR
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Trigger Type |
|
POSITIVE EDGE
|
|
|
|
Compare HEF40174BP with alternatives