HEF40174BDB vs 5962-01-071-4863 feature comparison

HEF40174BDB NXP Semiconductors

Buy Now Datasheet

5962-01-071-4863 Renesas Electronics Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Package Description DIP, ,
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-GDIP-T16
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP
Number of Bits 6
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Propagation Delay (tpd) 155 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Trigger Type POSITIVE EDGE
Width 7.62 mm
fmax-Min 5 MHz
Base Number Matches 1 1
Rohs Code No

Compare HEF40174BDB with alternatives

Compare 5962-01-071-4863 with alternatives